Jin Kyung Park

6 Patents

• US125557202026

  Multilayer Electronic Component with Enhanced Electrode Connectivity Using Ni and Al Oxide

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US124007912025

  Multilayer Electronic Component

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US123225562025

  Multilayer Electronic Component

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US121046382024

  Interlocking Fastening Upper Electrode Assembly Having Improved Fastening Force, and Plasma Device Including Same

  TEM CO., Ltd.

  0 cites
• US120303522024

  Method of Manufacturing a Hybrid Dip Cord Having Excellent Fatigue Resistance

  0 cites
• US118070542023

  Polyester Tire Cord and Radial Tire Using Same

  0 cites