Patents/Inventors

Jin Ho An

SeoulKR16 patents

16 Patents

US125937022026
Semiconductor Package and Method of Fabricating the Same
Samsung Electronics Co., Ltd.
0 cites
US124761802025
Interconnection Structure and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US124245722025
Semiconductor Device
Samsung Electronics Co., Ltd.
0 cites
US123680932025
Semiconductor Packages
Samsung Electronics Co., Ltd.
0 cites
US123477602025
Interconnection Structure and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121836642024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121070632024
Semiconductor Package Device
Samsung Electronics Co., Ltd.
0 cites
US120402942024
Semiconductor Devices and Semiconductor Packages Including the Same
Samsung Electronics Co., Ltd.
0 cites
US120092882024
Interconnection Structure and Semiconductor Package Including the Same
Samsung Electronics Co., Ltd.
0 cites
US119963582024
Semiconductor Packages Having First and Second Redistribution Patterns
Samsung Electronics Co., Ltd.
0 cites
US119233092024
Semiconductor Package Including Fine Redistribution Patterns
Samsung Electronics Co., Ltd.
0 cites
US117988722023
Interconnection Structure and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117422712023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116949782023
Semiconductor Devices and Semiconductor Packages Including the Same
Samsung Electronics Co., Ltd.
0 cites
US116370582023
Interconnection Structure and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115812792023
Semiconductor Device
Samsung Electronics Co., Ltd.
0 cites