Jin Hee Hong

3 Patents

• US124445772025

  Apparatus and Method for Processing Substrate

  SEMES CO., Ltd.

  0 cites
• US123477592025

  Semiconductor Package and Substrate for Semiconductor Package

  Samsung Electronics Co., Ltd.

  0 cites
• US122760252025

  Substrate Processing Apparatus and Substrate Processing Method

  SEMES CO., Ltd.

  0 cites