3 Patents
- US121018712024Circuit Board Using Thermocouple to Dissipate Generated Heat and Method for Manufacturing the Same
GARUDA TECHNOLOGY CO., Ltd.
0 cites - US117570802023Multi-sided Light-emitting Circuit Board and Manufacturing Method Thereof
QING DING PRECISION ELECTRONICS (HUAIAN) CO., Ltd
0 cites - US116963932023Method for Manufacturing Circuit Board with High Light Reflectivity
Avary Holding (Shenzhen) Co., Limited.
0 cites