5 Patents
- US126108222026Readily Assembled/disassembled Cooling Assembly for Immersion Cooled Semiconductor Chip Package
Intel Corporation
0 cites - US124904102025Circuit Devices Integrated with Boiling Enhancement for Two-phase Immersion Cooling
Intel Corporation
0 cites - US123099662025Thermally Conductive Chamber with Stiffening Structure for Thermal Cooling Assembly of Semiconductor Chip Package Under High Loading Force
Intel Corporation
0 cites - US122939562025Boiling Enhancement Structures for Immersion Cooled Electronic Systems
Intel Corporation
0 cites - 0 cites