Patents/Inventors

Jimin Yao

Chandler, AZUS11 patents

11 Patents

US125869062026
Antenna Package Using Ball Attach Array to Connect Antenna and Base Substrates
Intel Corporation
0 cites
US125388412026
Quasi-monolithic Die Architectures
Intel Corporation
0 cites
US123278012025
Robust Mold Integrated Substrate
Intel Corporation
0 cites
US122242612025
Mixed Hybrid Bonding Structures and Methods of Forming the Same
Intel Corporation
0 cites
US122059152025
Microelectronic Package with Solder Array Thermal Interface Material (SA-TIM)
Intel Corporation
0 cites
US120030232024
In-package 3D Antenna
Intel Corporation
0 cites
US119292952024
Multi-use Package Architecture
Intel Corporation
0 cites
US118701632024
Antenna Package Using Ball Attach Array to Connect Antenna and Base Substrates
Intel Corporation
0 cites
US117355512023
Aligned Core Balls for Interconnect Joint Stability
Intel Corporation
0 cites
US117355522023
Microelectronic Package with Solder Array Thermal Interface Material (SA-TIM)
Intel Corporation
0 cites
US115812382023
Heat Spreading Layer Integrated Within a Composite IC Die Structure and Methods of Forming the Same
Intel Corporation
0 cites