15 Patents
- US126076692026Semiconductor Chip and Semiconductor Package Including the Same
Samsung Electronics Co., Ltd.
0 cites - US125575792026Discharge Method, Discharge System and Substrate Processing Apparatus Including the Same
SAMSUNG DISPLAY CO., Ltd.
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- US124244892025Semiconductor Device Including Multi-capping Layer and Method for Manufacturing the Same
Samsung Electronics Co., Ltd.
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- US121836602024Semiconductor Device Including Through-silicon via and Method of Forming the Same
Samsung Electronics Co., Ltd.
0 cites - US121598592024Thermal Pad, Semiconductor Chip Including the Same and Method of Manufacturing the Semiconductor Chip
Samsung Electronics Co., Ltd.
0 cites - US120723742024Detection Pad Structure for Analysis in a Semiconductor Device
Samsung Electronics Co., Ltd.
0 cites - 0 cites
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- US116462252023Semiconductor Devices and Methods of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites