Jiing-feng Yang

8 Patents

• US125507212026

  Inter-wire Cavity for Low Capacitance

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US125435662026

  Semiconductor Devices and Method for Forming the Same

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• US122306032025

  Method of Fabricating a Semiconductor Chip Having Strength Adjustment Pattern in Bonding Layer

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US121659472024

  Semiconductor Devices and Method for Forming the Same

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• US121425742024

  Semiconductor Devices and Methods of Manufacture

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• US120027102024

  Semiconductor Structure and Methods of Forming the Same

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US117569242023

  Method of Fabricating a Semiconductor Chip Having Strength Adjustment Pattern in Bonding Layer

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US115519682023

  Inter-wire Cavity for Low Capacitance

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites