Patents/Inventors

Jihwang Kim

Cheonan-siKR20 patents

14 Patents

US126223022026
Semiconductor Package Including a Lower Substrate and an Upper Substrate
Samsung Electronics Co., Ltd.
0 cites
US126105602026
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US125754132026
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123880292025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123344542025
Semiconductor Package Including Molding Layer
Samsung Electronics Co., Ltd.
0 cites
US122611572025
Semiconductor Device Having Package on Package Structure and Method of Manufacturing the Semiconductor Device
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121487292024
Semiconductor Package Structure Having Interposer Substrate, and Stacked Semiconductor Package Structure Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120210362024
Semiconductor Package Including Interposer and Method of Manufacturing the Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118174012023
Semiconductor Package Including Molding Layer
Samsung Electronics Co., Ltd.
0 cites
US118044772023
Semiconductor Device Having Package on Package Structure and Method of Manufacturing the Semiconductor Device
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117988892023
Methods of Manufacturing Semiconductor Packages
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117106732023
Interposer and Semiconductor Package Including the Same
Samsung Electronics Co., Ltd.
0 cites
US116769492023
Semiconductor Packages Having Supporting Members
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115812632023
Semiconductor Package, and Package on Package Having the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites