Patents/Inventors

Jihwan Suh

Suwon-siKR5 patents

6 Patents

US120403132024
Semiconductor Package and a Method for Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119554492024
Stacked Semiconductor Package
SAMSUNG ELECTRONICS CO, Ltd.
0 cites
US117913082023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117641922023
Semiconductor Package Including Underfill Material Layer and Method of Forming the Same
Samsung Electronics Co., Ltd.
0 cites
US117216732023
Semiconductor Package Having Stacked Semiconductor Chips
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116581482023
Semiconductor Package and a Method for Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites