Patents/Inventors

Jihwan Hwang

Suwon-siKR9 patents

10 Patents

US125688372026
Semiconductor Chip, Semiconductor Package Including the Same, and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120574252024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US120403132024
Semiconductor Package and a Method for Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119554492024
Stacked Semiconductor Package
SAMSUNG ELECTRONICS CO, Ltd.
0 cites
US117913082023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117641922023
Semiconductor Package Including Underfill Material Layer and Method of Forming the Same
Samsung Electronics Co., Ltd.
0 cites
US117216732023
Semiconductor Package Having Stacked Semiconductor Chips
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116769252023
Semiconductor Packages Having Improved Reliability in Bonds Between Connection Conductors and Pads and Methods of Manufacturing the Same
Samsung Electronics Co., Ltd.
0 cites
US116581412023
Die-to-wafer Bonding Structure and Semiconductor Package Using the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116581482023
Semiconductor Package and a Method for Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites