Patents/Inventors

Jihong Choi

San Diego, CAUS1 patent

2 Patents

US122180412025
Integrated Circuit (IC) Packages Employing a Capacitor-embedded, Redistribution Layer (RDL) Substrate for Interfacing an IC Chip(s) to a Package Substrate, and Related Methods
QUALCOMM INCORPORATED
0 cites
US119730192024
Deep Trench Capacitors in an Inter-layer Medium on an Interconnect Layer of an Integrated Circuit Die and Related Methods
QUALCOMM Incorporated
0 cites