11 Patents
- US125754572026Chip Stacking Structure and Preparation Method Thereof, Chip Stacking Package, and Electronic Device
HUAWEI TECHNOLOGIES CO., Ltd.
0 cites - US124904402025Three-dimensional Memory Devices and Fabricating Methods Thereof
YANGTZE MEMORY TECHNOLOGIES CO., Ltd.
0 cites - 0 cites
- US120637802024Memory Cell Structure of a Three-dimensional Memory Device
YANGTZE MEMORY TECHNOLOGIES CO., Ltd.
0 cites - 0 cites
- US119963222024Method for Forming Lead Wires in Hybrid-bonded Semiconductor Devices
Yangtze Memory Technologies Co., Ltd.
0 cites - US119918802024Three-dimensional Memory Devices and Fabricating Methods Thereof
Yangtze Memory Technologies Co., Ltd.
0 cites - US118056462023Three-dimensional Memory Devices and Methods for Forming the Same
Yangtze Memory Technologies Co., Ltd.
0 cites - US117912652023Method for Forming Three-dimensional Integrated Wiring Structure and Semiconductor Structure Thereof
Yangtze Memory Technologies Co., Ltd.
0 cites - US116996572023Three-dimensional Memory Devices Having a Plurality of NAND Strings Located Between a Substrate and a Single Crystalline Silicon Layer
Yangtze Memory Technologies Co., Ltd.
0 cites - US116705432023Method for Forming Lead Wires in Hybrid-bonded Semiconductor Devices
YANGTZE MEMORY TECHNOLOGIES CO., Ltd.
0 cites