9 Patents
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- US121912402025Hybrid Glass Core for Wafer Level and Panel Level Packaging Applications
Intel Corporation
0 cites - US121257772024Minimizing Package Impedance Discontinuity Through Dielectric Structure Optimizations
Intel Corporation
0 cites - US120339302024Selectively Roughened Copper Architectures for Low Insertion Loss Conductive Features
Intel Corporation
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- US115748622023Optimal Signal Routing Performance Through Dielectric Material Configuration Designs in Package Substrate
Intel Corporation
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