6 Patents
- US124566922025Microelectronic Package RDL Patterns to Reduce Stress in Rdls Across Components
Apple Inc.
0 cites - US122495992025Multiple Chip Module Trenched Lid and Low Coefficient of Thermal Expansion Stiffener Ring
Apple Inc.
0 cites - US121192752024Recessed Lid and Ring Designs and Lid Local Peripheral Reinforcement Designs
Apple Inc.
0 cites - 0 cites
- US116463022023Multiple Chip Module Trenched Lid and Low Coefficient of Thermal Expansion Stiffener Ring
Apple Inc.
0 cites - 0 cites