Jianwen Xu

3 Patents

• US125023522025

  Formulations of Anti-interleukin 1 Receptor 1 Antibodies

  Kiniksa Pharmaceuticals, GmbH

  0 cites
• US122180412025

  Integrated Circuit (IC) Packages Employing a Capacitor-embedded, Redistribution Layer (RDL) Substrate for Interfacing an IC Chip(s) to a Package Substrate, and Related Methods

  QUALCOMM INCORPORATED

  0 cites
• US117841572023

  Package Comprising Integrated Devices Coupled Through a Metallization Layer

  QUALCOMM INCORPORATED

  0 cites