Patents/Inventors

Jianshe Tang

San Jose, CAUS29 patents

29 Patents

US125764752026
Determining the Orientation of a Substrate In-situ
Applied Materials, Inc.
0 cites
US124590112025
Steam Treatment Stations for Chemical Mechanical Polishing System
Applied Materials, Inc.
0 cites
US124590782025
In-situ Conditioner Disk Cleaning During CMP
Applied Materials, Inc.
0 cites
US124343472025
Method for CMP Temperature Control
Applied Materials, Inc.
0 cites
US124008812025
Apparatus and Method of Substrate Edge Cleaning and Substrate Carrier Head Gap Cleaning
Applied Materials, Inc.
0 cites
US123188822025
Apparatus and Method for CMP Temperature Control
Applied Materials, Inc.
0 cites
US122964272025
Apparatus and Method for CMP Temperature Control
Applied Materials, Inc.
0 cites
US122908962025
Apparatus and Method for CMP Temperature Control
Applied Materials, Inc.
0 cites
US122858382025
Wafer Edge Asymmetry Correction Using Groove in Polishing Pad
Applied Materials, Inc.
0 cites
US122144682025
Temperature Control of Chemical Mechanical Polishing
Applied Materials, Inc.
0 cites
US121069762024
Steam-assisted Single Substrate Cleaning Process and Apparatus
Applied Materials, Inc.
0 cites
US120300932024
Steam Treatment Stations for Chemical Mechanical Polishing System
Applied Materials, Inc.
0 cites
US119869262024
Slurry Distribution Device for Chemical Mechanical Polishing
Applied Materials, Inc.
0 cites
US119515892024
Wafer Edge Asymmetry Correction Using Groove in Polishing Pad
Applied Materials, Inc.
0 cites
US119488852024
Methods and Apparatus for Forming Dual Metal Interconnects
APPLIED MATERIALS, Inc.
0 cites
US119318542024
Chemical Mechanical Polishing Using Time Share Control
Applied Materials, Inc.
0 cites
US118970792024
Low-temperature Metal CMP for Minimizing Dishing and Corrosion, and Improving Pad Asperity
Applied Materials, Inc.
0 cites
US118839232024
Chemical Mechanical Polishing Using Time Share Control
Applied Materials, Inc.
0 cites
US118656712024
Temperature-based In-situ Edge Assymetry Correction During CMP
Applied Materials, Inc.
0 cites
US118268722023
Temperature and Slurry Flow Rate Control in CMP
Applied Materials, Inc.
0 cites
US118239162023
Apparatus and Method of Substrate Edge Cleaning and Substrate Carrier Head Gap Cleaning
Applied Materials, Inc.
0 cites
US118068352023
Slurry Distribution Device for Chemical Mechanical Polishing
Applied Materials, Inc.
0 cites
US117870082023
Chemical Mechanical Polishing with Applied Magnetic Field
Applied Materials, Inc.
0 cites
US117525892023
Chemical Mechanical Polishing Temperature Scanning Apparatus for Temperature Control
Applied Materials, Inc.
0 cites
US117281852023
Steam-assisted Single Substrate Cleaning Process and Apparatus
Applied Materials, Inc.
0 cites
US116971872023
Temperature-based Assymetry Correction During CMP and Nozzle for Media Dispensing
Applied Materials, Inc.
0 cites
US116338332023
Use of Steam for Pre-heating of CMP Components
Applied Materials, Inc.
0 cites
US116284782023
Steam Cleaning of CMP Components
Applied Materials, Inc.
0 cites
US115970522023
Temperature Control of Chemical Mechanical Polishing
Applied Materials, Inc.
0 cites