Patents/Inventors

Jiandi Du

ShanghaiCN5 patents

5 Patents

US123478102025
Semiconductor Device Package Die Stacking System and Method
Western Digital Technologies, Inc.
0 cites
US119012602024
Thermoelectric Semiconductor Device and Method of Making Same
Western Digital Technologies, Inc.
0 cites
US118374762023
Flip-chip Package with Reduced Underfill Area
WESTERN DIGITAL TECHNOLOGIES, Inc.
0 cites
US118108962023
Substrate Component Layout and Bonding Method for Increased Package Capacity
Western Digital Technologies, Inc.
0 cites
US117841352023
Semiconductor Device Including Conductive Bumps to Improve EMI/RFI Shielding
Western Digital Technologies, Inc.
0 cites