Jian-wei Hong

7 Patents

• US126222902026

  Chip Structure and Method of Fabricating the Same

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US125576982026

  Package and Manufacturing Method Thereof

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US123278152025

  Integrated Circuit Package and Method of Forming the Same

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites
• US123226732025

  3DIC with Heat Dissipation Structure and Warpage Control

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites
• US122726222025

  Package and Manufacturing Method Thereof

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US121660142024

  Manufacturing Method of Package

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US116996382023

  Package and Manufacturing Method Thereof

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites