Jian-ci Lin

2 Patents

• US125506952026

  Methods of Forming an Abrasive Slurry and Methods for Chemical-mechanical Polishing

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US121319442024

  Slurry Composition, Semiconductor Structure and Method for Forming the Same

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.

  0 cites