Jia Hao Liang

3 Patents

• US123960952025

  Circuit Board with Low Grain Boundary Density and Forming Method Thereof

  Unimicron Technology Corp

  0 cites
• US120893472024

  Method of Improving Wire Structure of Circuit Board and Improving Wire Structure of Circuit Board

  UNIMICRON TECHNOLOGY Corp.

  0 cites
• US119249612024

  Circuit Board and Method of Manufacturing the Same

  Unimicron Technology Corp.

  0 cites