14 Patents
- US124761712025Land Structure for Semiconductor Package and Method Therefor
Amkor Technology Singapore Holding Pte. Ltd.
0 cites - US124381102025Fingerprint Sensor and Manufacturing Method Thereof
Amkor Technology Singapore Holding Pte. Ltd.
0 cites - US123880322025Semiconductor Device with Redistribution Layers Formed Utilizing Dummy Substrates
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. Ltd.
0 cites - US122372392025Semiconductor Device and Manufacturing Method Thereof
Amkor Technology Singapore Holding Pte. Ltd.
0 cites - US121764432024Electronic Sensor Devices and Methods of Manufacturing Electronic Sensor Devices
Amkor Technology Singapore Holding Pte. Ltd.
0 cites - US121070352024Semiconductor Device with a Semiconductor Die Embedded Between an Extended Substrate and a Bottom Substrate
Amkor Technology Singapore Holdings Pte. Ltd.
0 cites - US120339462024Semiconductor Devices and Methods of Manufacturing Semiconductor Devices
Amkor Technology Singapore Holding Pte. Ltd.
0 cites - US120027252024Sensor Package and Manufacturing Method Thereof
Amkor Technology Singapore Holding Pte. Ltd.
0 cites - US119904352024Fingerprint Sensor and Manufacturing Method Thereof
Amkor Technology Singapore Holding Pte. Ltd.
0 cites - US119617942024Method of Forming a Molded Substrate Electronic Package and Structure
Amikor Technology Singapore Holding Pte. Ltd.
0 cites - US119087792024Land Structure for Semiconductor Package and Method Therefor
Amkor Technology Singapore Holding Pte. Ltd.
0 cites - US116825982023Sensor Package and Manufacturing Method Thereof
Amkor Technology Singapore Holding Pte.
0 cites - US116005822023Semiconductor Device with Redistribution Layers Formed Utilizing Dummy Substrates
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. Ltd.
0 cites - US115945122023Method of Manufacturing an Electronic Device and Electronic Device Manufactured Thereby
Amkor Technology Singapore Holding Pte. Ltd.
0 cites