63 Patents
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- US125623122026Dielectric Ceramic Composition and Multilayer Ceramic Capacitor Comprising the Same
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US124826022025Dielectric Ceramic Composition and Multilayer Ceramic Capacitor Comprising the Same
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - 0 cites
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SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US122550232025Method of Manufacturing Multilayer Ceramic Electronic Component and Multilayer Ceramic Electronic Component
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - 0 cites
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SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US121988602025Multilayer Electronic Component and Method of Manufacturing the Same
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - 0 cites
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SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US121365232024Multilayer Capacitor and Board Having the Same Mounted Thereon
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US119842672024Dielectric Composition and Multilayered Electronic Component Comprising the Same
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - 0 cites
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- US119487522024Ceramic Electronic Component and Method of Manufacturing the Same
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - 0 cites
- US118759482024Multilayer Capacitor and Substrate Including the Same Mounted Thereon
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US118624042024Multilayer Electronic Component for Enhanced Moisture Resistance and Bending Strength
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US118547462023Dielectric Ceramic Composition and Multilayer Ceramic Capacitor Comprising the Same
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - 0 cites
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- US118172652023Dielectric Ceramic Composition and Multilayer Ceramic Capacitor Comprising the Same
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US118172712023Multilayer Electronic Component Including a Silicon Organic Compound Layer Arranged Between Layers of an External Electrode
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - 0 cites
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- US117767482023Dielectric Ceramic Composition and Multilayer Ceramic Capacitor Comprising the Same
Samsung Electro-mechanics Co., Ltd.
0 cites - US117767532023Multilayer Electronic Component and Board Having the Same Mounted Thereon
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US117639862023Electronic Component Including Insulating Layer Between Body and Shielding Layer
Samsung Electro-mechanics Co., Ltd.
0 cites - US117639902023Dielectric Ceramic Composition and Multilayer Ceramic Capacitor Comprising Same
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - 0 cites
- US117353612023Dielectric Ceramic Composition and Multilayer Ceramic Capacitor Comprising the Same
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US117353622023Dielectric Ceramic Composition and Multilayer Ceramic Capacitor Comprising the Same
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - 0 cites
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- US116658252023Electronic Component and Board Having the Same Mounted Thereon
Samsung Electro-mechanics Co., Ltd.
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- US116519002023Multilayer Electronic Component Having Moisture-proof Layer on Body Thereof
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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- US115943712023Conductive Powder for Internal Electrode and Capacitor Component Including the Same
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US115943752023Multilayer Capacitor and Substrate Including the Same Mounted Thereon
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US115690372023Ceramic Electronic Component and Method of Manufacturing the Same
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US115518662023Multilayer Ceramic Capacitor and Method of Manufacturing the Same
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US115518742023Multilayer Ceramic Electronic Component and Method of Manufacturing the Same
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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