8 Patents
- US125529622026CMP Slurry Composition for Polishing Tungsten Pattern Wafer and Method of Polishing Tungsten Pattern Wafer Using the Same
SAMSUNG SDI CO., Ltd.
0 cites - US125402562026CMP Slurry Composition for Polishing Copper and Copper Film Polishing Method Using the Same
SAMSUNG SDI CO., Ltd.
0 cites - 0 cites
- US123957622025Image Sensor with Color Matching Analog to Digital Conversion and Color Matching Method
SK Hynix Inc.
0 cites - US120776812024CMP Slurry Composition for Polishing Tungsten Pattern Wafer and Method of Polishing Tungsten Pattern Wafer Using the Same
SAMSUNG SDI CO., Ltd.
0 cites - US119497462024Iot Device Connected to Server via NAT, and Iot Communication Method
KOREA ELECTRONICS TECHNOLOGY INSTITUTE
0 cites - US119426922024In-band Full Duplex MIMO Antenna and Transceiver Using the Antenna
CHUNG ANG UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION
0 cites - 0 cites