5 Patents
- US122898312025Providing One or More Carbon Layers to a Copper Conductive Material to Reduce Power Loss in a Power Plane
CISCO TECHNOLOGY, Inc.
0 cites - US121609482024Integrating Graphene Into the Skin Depth Region of High Speed Communications Signals for a Printed Circuit Board
CISCO TECHNOLOGY, Inc.
0 cites - 0 cites
- US117513222023Integrating Graphene Into the Skin Depth Region of High Speed Communications Signals for a Printed Circuit Board
CISCO TECHNOLOGY, Inc.
0 cites - US117068702023Providing One or More Carbon Layers to a Copper Conductive Material to Reduce Power Loss in a Power Plane
CISCO TECHNOLOGY, Inc.
0 cites