Patents/Inventors

Jesse Jones

Chandler, AZUS5 patents

5 Patents

US125688312026
Patternable Die Attach Materials and Processes for Patterning
Intel Corporation
0 cites
US123549632025
Lithographic Cavity Formation to Enable EMIB Bump Pitch Scaling
Intel Corporation
0 cites
US123344432025
Lithographic Cavity Formation to Enable EMIB Bump Pitch Scaling
Intel Corporation
0 cites
US119293302024
Lithographic Cavity Formation to Enable EMIB Bump Pitch Scaling
Intel Corporation
0 cites
US119233122024
Patternable Die Attach Materials and Processes for Patterning
Intel Corporation
0 cites