21 Patents
- US124811082025Faraday Rotator Interconnect as a Through-via Configuration in a Patch Architecture
Intel Corporation
0 cites - 0 cites
- US124446722025Hybrid Bonding Technologies with Thermal Expansion Compensation Structures
Intel Corporation
0 cites - US124226152025Nested Glass Packaging Architecture for Hybrid Electrical and Optical Communication Devices
Intel Corporation
0 cites - US124128682025Microelectronic Assemblies Including Interconnects with Different Solder Materials
Intel Corporation
0 cites - 0 cites
- 0 cites
- US122551472025Electronic Substrate Having an Embedded Etch Stop to Control Cavity Depth in Glass Layers Therein
Intel Corporation
0 cites - 0 cites
- US121911612025Multi-step Isotropic Etch Patterning of Thick Copper Layers for Forming High Aspect-ratio Conductors
Intel Corporation
0 cites - US120741022024Structural Elements for Application Specific Electronic Device Packages
Intel Corporation
0 cites - US120339302024Selectively Roughened Copper Architectures for Low Insertion Loss Conductive Features
Intel Corporation
0 cites - US119488482024Subtractive Etch Resolution Implementing a Functional Thin Metal Resist
Intel Corporation
0 cites - US119423342024Microelectronic Assemblies Having Conductive Structures with Different Thicknesses
Intel Corporation
0 cites - 0 cites
- 0 cites
- 0 cites
- 0 cites
- 0 cites
- 0 cites
- 0 cites