12 Patents
- US126047442026Integration of Glass Core Into Electronic Substrates for Fine Pitch Die Tiling
Intel Corporation
0 cites - US125754272026Defect-free Through Glass via Metallization Implementing a Sacrificial Resist Thinning Material
Intel Corporation
0 cites - US125435782026Electronic Packaging Architecture with Customized Variable Metal Thickness on Same Buildup Layer
Intel Corporation
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- US117216312023Via Structures Having Tapered Profiles for Embedded Interconnect Bridge Substrates
Intel Corporation
0 cites - US117216502023Method for Fabricating Multiplexed Hollow Waveguides of Variable Type on a Semiconductor Package
Intel Corporation
0 cites - US116705042023Ultra-thin Dielectric Films Using Photo Up-conversion for Applications in Substrate Manufacturing and Integrating Passives
Intel Corporation
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- US116058672023Fabricating an RF Filter on a Semiconductor Package Using Selective Seeding
Intel Corporation
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