22 Patents
- US125936842026Semiconductor Package Including Heat Dissipation Structure
Samsung Electronics Co., Ltd.
0 cites - US124995582025Apparatus and Method for Monitoring Moving Target Based on Complementary Gimbal Control Through Displacement Partitioning
AGENCY FOR DEFENSE DEVELOPMENT
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- US121598262024Semiconductor Package and Method of Manufacturing the Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
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- US121112062024Vision Sensor Including a Voltage Generation Circuit for Outputting a Test Bias Voltage to a Transistor and Operating Method Thereof
SAMSUNG ELECTRONICS CO., Ltd.
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- US119026732024Electronic Device for Compensating for Time Delay of Dynamic Vision Sensor
Samsung Electronics Co., Ltd.
0 cites - US117282832023Package Substrate and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
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