22 Patents
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- US122726612025Semiconductor Package Including Semiconductor Chips Stacked via Conductive Bumps
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US122611572025Semiconductor Device Having Package on Package Structure and Method of Manufacturing the Semiconductor Device
SAMSUNG ELECTRONICS CO., Ltd.
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- US118987872024Refrigerator with Automatic Door Opening and Controlling Method Thereof
Samsung Electronics Co., Ltd.
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- US118044772023Semiconductor Device Having Package on Package Structure and Method of Manufacturing the Semiconductor Device
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US117748772023Developer Cartridge Including Structure for Detecting Developer End
Hewlett-packard Development Company, L.P.
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