Patents/Inventors

Jeonghyuk Park

IncheonKR11 patents

9 Patents

US125937362026
Power Module Package with Stacked Direct Bonded Metal Substrates
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
USD11137762026
Power Module Package
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
USD10980552025
Power Module Package
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
USD10954742025
Power Module Package
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US123533522025
Method for Implementing Re-instantiation for Database
TMAXTIBERO CO., Ltd.
0 cites
US123006892025
Dual Cool Power Module with Stress Buffer Layer
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122117712025
Power Module and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US116581712023
Dual Cool Power Module with Stress Buffer Layer
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US116520302023
Power Module and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites