Patents/Inventors

Jeong-kyu Ha

Hwaseong-siKR3 patents

4 Patents

US121912462025
Chip-on-film Package Having Redistribution Pattern Between Semiconductor Chip and Connection Terminal
Samsung Electronics Co., Ltd.
0 cites
US118308032023
Chip-on-film Package Having Redistribution Pattern Between Semiconductor Chip and Connection Terminal
Samsung Electronics Co., Ltd.
0 cites
US117641402023
Semiconductor Device
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116005562023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites