Patents/Inventors

Jens Palm

BerlinDE1 patent

2 Patents

US120717022024
Acidic Aqueous Composition for Electrolytic Copper Plating
Atotech Deutschland GmbH
0 cites
US120548432024
Acidic Aqueous Composition for Electrolytically Depositing a Copper Deposit
Atotech Deutschland GmbH & Co. KG
0 cites