10 Patents
- US121924612025Apparatus and Method for Encoding and Decoding a Picture Using Picture Boundary Handling
Fraunhofer-gesellschaft Zur Förderung Derangewandten Forschung E.v.
0 cites - US121836962024Semiconductor Device Including Bonding Pad Metal Layer Structure
Infineon Technologies AG
0 cites - US121605682024Apparatus for Selecting an Intra-prediction Mode for Padding
Fraunhofer-gesellschaft Zur Förderung Der Angewandten Forschung, E.v.
0 cites - US121202982024Encoder and Decoder, Encoding Method and Decoding Method for Versatile Spatial Partitioning of Coded Pictures
Fraunhofer-gesellschaft Zur Förderung Derangewandten Forschung E.v.
0 cites - US121080842024Decoder, Encoder and Methods Comprising a Coding for Intra Subpartitions
Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v.
0 cites - US118437742023Apparatus and Method for Encoding and Decoding a Picture Using Picture Boundary Handling
Fraunhofer-gesellschaft Zur Förderung Der Angewandten Forschung E.v.
0 cites - US118052412023Concept for Enhancing Parallel Coding Capabilities
Fraunhofer-gesellschaft Zur Förderung Der Angewandten Forschung E.v.
0 cites - US117705282023Encoder and Decoder, Encoding Method and Decoding Method for Versatile Spatial Partitioning of Coded Pictures
Fraunhofer-gesellschaft Zur Förderung Der Angewandten Forschung E.v.
0 cites - US117641762023Semiconductor Device Including Bonding Pad Metal Layer Structure
Infineon Technologies AG
0 cites - US116834852023Apparatus for Selecting an Intra-prediction Mode for Padding
Fraunhofer-gesellschaft Zur Förderung Der Angewandten Forschung E.v.
0 cites