Patents/Inventors

Jeng-nan Hung

TaichungTW8 patents

9 Patents

US125001082025
Bonding System and Method
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124446652025
Semiconductor Device
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123410792025
Package Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122611422025
Semiconductor Structure Including Thermal Enhanced Bonding Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118549362023
Semiconductor Device
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118308442023
Semiconductor Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117568522023
Semiconductor Device
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US116409542023
Semiconductor Package Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites
US115748532023
Semiconductor Device
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites