Jen Yu Wang

3 Patents

• US126222712026

  Cooling Cover and Packaged Semiconductor Device Including the Same

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites
• US119963512024

  Packaged Semiconductor Device Including Liquid-cooled Lid and Methods of Forming the Same

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites
• US119554052024

  Semiconductor Package Including Thermal Interface Structures and Methods of Forming the Same

  Taiwan Semiconductor Manufacturing Company Limited

  0 cites