Jen-wei Liu

2 Patents

• US125576292026

  Interconnect Structure and Methods of Forming the Same

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US120805942024

  Thermally Stable Copper-alloy Adhesion Layer for Metal Interconnect Structures and Methods for Forming the Same

  Taiwan Semiconductor Manufacturing Company Limited

  0 cites