4 Patents
- US118897052024Interconnect Landing Method for RRAM Technology
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US118442862023Flat Bottom Electrode via (BEVA) Top Surface for Memory
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117514852023Flat Bottom Electrode via (BEVA) Top Surface for Memory
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US116785922023Step Height Mitigation in Resistive Random Access Memory Structures
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites