Jen-chun Liao

6 Patents

• US124630672025

  Pickup Apparatus and Method of Using the Same

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US124069612025

  Integrated Circuit Package and Method

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites
• US121762792024

  Package Structure and Manufacturing Method Thereof

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US120402552024

  Semiconductor Package and Manufacturing Method Thereof

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US117641272023

  Semiconductor Package and Manufacturing Method Thereof

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US117568722023

  Package Structure and Manufacturing Method Thereof

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites