13 Patents
- 0 cites
- US124944352025Liquid Metal Interconnect for Modular System on an Interposer Server Architecture
Intel Corporation
0 cites - 0 cites
- US124530542025Cooling Assembly with Strap Element to Diminish Lateral Movement of Cooling Mass During Installation of the Cooling Mass
Intel Corporation
0 cites - US124446642025Loading Frame for High I/O Count Packaged Semiconductor Chip
SK Hynix NAND Product Solutions Corp.
0 cites - 0 cites
- 0 cites
- US122793952025Patterned Bolster Plate and Composite Back Plate for Semiconductor Chip LGA Package and Cooling Assembly Retention
Intel Corporation
0 cites - US121319772024Electronic Systems with Inverted Circuit Board with Heat Sink to Chassis Attachment
Intel Corporation
0 cites - US118429432023Electronic Systems with Inverted Circuit Board with Heat Sink to Chassis Attachment
INTEL CORPORATION
0 cites - 0 cites
- 0 cites
- 0 cites