8 Patents
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- US116996672023Leadframe with Pad Anchoring Members and Method of Forming the Same
STMICROELECTRONICS, Inc.
0 cites - US116642392023Lead Frame for Improving Adhesive Fillets on Semiconductor Die Corners
Stmicroelectronics, Inc.
0 cites - US116580982023Leadframe Package with Side Solder Ball Contact and Method of Manufacturing
Stmicroelectronics, Inc.
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