8 Patents
- US124944422025Leadframe with Varying Thicknesses and Method of Manufacturing Semiconductor Packages
STMICROELECTRONICS, Inc.
0 cites - US124211082025Capless Semiconductor Package with a Micro-electromechanical System (mems)
Stmicroelectronics, Inc.
0 cites - US122117722025Method of Manufacturing Semiconductor Devices and Corresponding Semiconductor Device
Stmicroelectronics, Inc.
0 cites - US121702402024Lead Frame for Improving Adhesive Fillets on Semiconductor Die Corners
Stmicroelectronics, Inc.
0 cites - 0 cites
- US118977632024Capless Semiconductor Package with a Micro-electromechanical System (MEMS)
Stmicroelectronics, Inc.
0 cites - 0 cites
- 0 cites