Jeb Wu

4 Patents

• US117356892023

  Dielectric-dielectric and Metallization Bonding via Plasma Activation and Laser-induced Heating

  Meta Platforms Technologies, LLC

  0 cites
• US115750692023

  Employing Deformable Contacts and Pre-applied Underfill for Bonding LED Devices via Lasers

  Meta Platforms Technologies, LLC

  0 cites
• US115631422023

  Curing Pre-applied and Plasma-etched Underfill via a Laser

  Meta Platforms Technologies, LLC

  0 cites
• US115576922023

  Selectively Bonding Light-emitting Devices via a Pulsed Laser

  Meta Platforms Technologies, LLC

  0 cites