18 Patents
- US122835352025IC Die and Heat Spreaders with Solderable Thermal Interface Structures for Multi-chip Assemblies Including Solder Array Thermal Interconnects
Intel Corporation
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- US120465362024Integrated Heat Spreader with Enhanced Vapor Chamber for Multichip Packages
Intel Corporation
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- US119843772024IC Die and Heat Spreaders with Solderable Thermal Interface Structures for Assemblies Including Solder Array Thermal Interconnects
Intel Corporation
0 cites - US119358082024IC Die and Heat Spreaders with Solderable Thermal Interface Structures for Multi-chip Assemblies Including Solder Array Thermal Interconnects
Intel Corporation
0 cites - US119232672024IC Die with Solderable Thermal Interface Structures for Assemblies Including Solder Array Thermal Interconnects
Intel Corporation
0 cites - US119012622024Cooling Solution Including Microchannel Arrays and Methods of Forming the Same
Intel Corporation
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- US118044182023Direct Liquid Micro Jet (DLMJ) Structures for Addressing Thermal Performance at Limited Flow Rate Conditions
Intel Corporation
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- US116768832023Thermoelectric Coolers Combined with Phase-change Material in Integrated Circuit Packages
Intel Corporation
0 cites - US1167056120233D Buildup of Thermally Conductive Layers to Resolve Die Height Differences
Intel Corporation
0 cites - US116642942023Phase Change Materials for Electromagnetic Interference Shielding and Heat Dissipation in Integrated Circuit Assemblies
Intel Corporation
0 cites - 0 cites