Patents/Inventors

Je-hsiung Lan

San Diego, CAUS34 patents

26 Patents

US126209702026
Integrated Devices with Multiple Acoustic Resonator Chiplets
QUALCOMM INCORPORATED
0 cites
US125819562026
Through Molding Contact Enabled EMI Shielding
QUALCOMM INCORPORATED
0 cites
US125433282026
Inductive Device Structure and Process Method
QUALCOMM Incorporated
0 cites
US125125932025
Antenna Module as a Radio-frequency (RF) Integrated Circuit (IC) Die with an Integrated Antenna Substrate, and Related Fabrication Methods
QUALCOMM INCORPORATED
0 cites
US124245182025
Capacitor Embedded 3D Resonator for Broadband Filter
QUALCOMM Incorporated
0 cites
US123951522025
Compact Hybrid Acoustic Wave Filter Structure
QUALCOMM INCORPORATED
0 cites
US123549482025
Integrated Device and Integrated Passive Device Comprising Magnetic Material
QUALCOMM INCORPORATED
0 cites
US123349032025
Substrate Comprising Acoustic Resonators Configured as at Least One Acoustic Filter
QUALCOMM Incorporated
0 cites
US122836072025
3D Inductor Design Using Bundle Substrate Vias
QUALCOMM Incorporated
0 cites
US122553812025
Antenna Modules Employing Three-dimensional (3D) Build-up on Mold Package to Support Efficient Integration of Radio-frequency (RF) Circuitry, and Related Fabrication Methods
QUALCOMM Incorporated
0 cites
US122061552025
Radio Frequency Oscillator with Ceramic Resonator and Surface-mounted Integrated Circuit Package
QUALCOMM INCORPORATED
0 cites
US121553732024
Backend and Acoustic Process Integration for High-q Filter
QUALCOMM INCORPORATED
0 cites
US121425612024
Integrated Device and Integrated Passive Device Comprising Magnetic Material
QUALCOMM INCORPORATED
0 cites
US120465302024
Thermal Bridge Interposer Structure
QUALCOMM INCORPORATED
0 cites
US120402682024
Thin Film Resistor (TFR) Device Structure for High Performance Radio Frequency (RF) Filter Design
QUALCOMM Incorporated
0 cites
US119848742024
Surface Acoustic Wave (SAW) Filter Packages Employing an Enhanced Thermally Conductive Cavity Frame for Heat Dissipation, and Related Fabrication Methods
QUALCOMM INCORPORATED
0 cites
US118623672024
Esl-less AC Resistor for High Frequency Applications
QUALCOMM Incorporated
0 cites
US117912262023
Device on Ceramic Substrate
QUALCOMM INCORPORATED
0 cites
US117497462023
Radio Frequency Front End (RFFE) Hetero-integration
QUALCOMM Incorporated
0 cites
US116891812023
Package Comprising Stacked Filters with a Shared Substrate Cap
QUALCOMM INCORPORATED
0 cites
US116581032023
Capacitor Interposer Layer (CIL) Chiplet Design with Conformal Die Edge Pattern Around Bumps
QUALCOMM Incorporated
0 cites
US116520642023
Integrated Device with Electromagnetic Shield
QUALCOMM Incorporated
0 cites
US116524682023
High Performance Tunable Filter
QUALCOMM Incorporated
0 cites
US116262362023
Stacked Inductor Having a Discrete Metal-stack Pattern
QUALCOMM Incorporated
0 cites
US116056202023
Three-dimensional (3D) Integrated Circuit with Passive Elements Formed by Hybrid Bonding
QUALCOMM INCORPORATED
0 cites
US115948042023
Antenna on Glass with Air Cavity Structure
QUALCOMM Incorporated
0 cites