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Jaynal A Molla
Gilbert, AZ
US
3 patents
4 Patents
US12482719
2025
Low-stress Thermal Interface
NXP USA, Inc.
0 cites
US12094801
2024
Thick-silver Layer Interface
NXP USA, Inc.
0 cites
US11749639
2023
Die-substrate Assemblies Having Sinter-bonded Backside via Structures and Associated Fabrication Methods
NXP USA, Inc.
0 cites
US11616040
2023
Semiconductor Dies Having Ultra-thin Wafer Backmetal Systems, Microelectronic Devices Containing the Same, and Associated Fabrication Methods
NXP USA, Inc.
0 cites