3 Patents
- US123344142025Power Semiconductor Device with Dual Heat Dissipation Structures
Infineon Technologies AG
0 cites - US119843922024Semiconductor Package Having a Chip Carrier with a Pad Offset Feature
Infineon Technologies AG
0 cites - US119087712024Power Semiconductor Device with Dual Heat Dissipation Structures
Infineon Technologies AG
0 cites