4 Patents
- US121006492024Package Comprising an Integrated Device with a Back Side Metal Layer
QUALCOMM INCORPORATED
0 cites - US121006692024Multi-component Modules (mcms) Including Configurable Electromagnetic Isolation (EMI) Shield Structures and Related Methods
QUALCOMM INCORPORATED
0 cites - US119858042024Package Comprising a Block Device with a Shield and Method of Fabricating the Same
QUALCOMM INCORPORATED
0 cites - US117216392023Multi-component Modules (mcms) Including Configurable Electro-magnetic Isolation (EMI) Shield Structures, and Related Methods
QUALCOMM INCORPORATED
0 cites