Patents/Inventors

Jay Gurusamy

Santa Clara, CAUS31 patents

29 Patents

US126222172026
High Throughput Polishing Modules and Modular Polishing Systems
Applied Materials, Inc.
0 cites
US126057662026
Methods for Upper Platen Manufacturing
Applied Materials, Inc.
0 cites
US124008922025
High Throughput Polishing Modules and Modular Polishing Systems
Applied Materials, Inc.
0 cites
US123946512025
High Throughput Polishing Modules and Modular Polishing Systems
Applied Materials, Inc.
0 cites
US123650602025
Chemical Mechanical Polishing Correction Tool
Applied Materials, Inc.
0 cites
US123374392025
Multiple Disk Pad Conditioner
Applied Materials, Inc.
0 cites
US123302622025
Dual Membrane Carrier Head for Chemical Mechanical Polishing
Applied Materials, Inc.
0 cites
US123082722025
High Throughput Polishing Modules and Modular Polishing Systems
Applied Materials, Inc.
0 cites
US122517882025
Polishing Head with Local Wafer Pressure
APPLIED MATERIALS, Inc.
0 cites
US122517872025
Modular Chemical Mechanical Polisher with Simultaneous Polishing and Pad Treatment
Applied Materials, Inc.
0 cites
US122144692025
Polishing Head Retaining Ring Tilting Moment Control
Applied Materials, Inc.
0 cites
US121945912025
Roller for Location-specific Wafer Polishing
Applied Materials, Inc.
0 cites
US121387332024
Roller for Location-specific Wafer Polishing
Applied Materials, Inc.
0 cites
US121285242024
Membrane for Carrier Head with Segmented Substrate Chuck
Applied Materials, Inc.
0 cites
US120768772024
Polishing Platens and Polishing Platen Manufacturing Methods
APPLIED MATERIALS, Inc.
0 cites
US120428992024
Polishing Head with Membrane Position Control
Applied Materials, Inc.
0 cites
US119869232024
Polishing Head with Local Wafer Pressure
APPLIED MATERIALS, Inc.
0 cites
US119450732024
Dual Membrane Carrier Head for Chemical Mechanical Polishing
Applied Materials, Inc.
0 cites
US119318572024
Deformable Substrate Chuck
Applied Materials, Inc.
0 cites
US119191202024
Polishing System with Contactless Platen Edge Control
Applied Materials, Inc.
0 cites
US119044292024
Substrate Polishing Apparatus with Contact Extension or Adjustable Stop
Applied Materials, Inc.
0 cites
US118907172024
Polishing System with Platen for Substrate Edge Control
Applied Materials, Inc.
0 cites
US117800492023
Polishing Carrier Head with Multiple Angular Pressurizable Zones
Applied Materials, Inc.
0 cites
US117599112023
Carrier Head with Segmented Substrate Chuck
Applied Materials, Inc.
0 cites
US117452272023
Substrate Cleaning Devices and Methods Thereof
Applied Materials, Inc.
0 cites
US117243572023
Pivotable Substrate Retaining Ring
Applied Materials, Inc.
0 cites
US117179362023
Methods for a Web-based CMP System
Applied Materials, Inc.
0 cites
US116233212023
Polishing Head Retaining Ring Tilting Moment Control
Applied Materials, Inc.
0 cites
US116233202023
Polishing Head with Membrane Position Control
Applied Materials, Inc.
0 cites