Patents/Inventors

Javier Soto Gonzalez

Chandler, AZUS5 patents

6 Patents

US122180712025
Panel Level Packaging for Multi-die Products Interconnected with Very High Density (VHD) Interconnect Layers
Intel Corporation
0 cites
US121990672025
Scalable Embedded Silicon Bridge via Pillars in Lithographically Defined Vias, and Methods of Making Same
Intel Corporation
0 cites
US120681722024
Sacrificial Pads to Prevent Galvanic Corrosion of FLI Bumps in EMIB Packages
Intel Corporation
0 cites
US120027452024
High Performance Integrated RF Passives Using Dual Lithography Process
Intel Corporation
0 cites
US118814572024
Semiconductor Packaging with High Density Interconnects
Tahoe Research, Ltd.
0 cites
US117355312023
Panel Level Packaging for Multi-die Products Interconnected with Very High Density (VHD) Interconnect Layers
Intel Corporation
0 cites